產品

空氣主軸

半導體後段切割 Model 2-B
Features
Contents Specification
Input
Air
Condition		 Pressure 5.5kgf/㎠ – 6.5kgf/㎠
Temperature 20℃
Filter 0.5 ~ 1.0㎛
Air Consumption 25ℓ/min
Cooling
Fluid		 Class Water or oil
Pressure 3kgf/㎠
Cooling Flow Rate 2ℓ/min
Temperature 17 ~ 19℃
Motor 2pole, BLDC,
Rated Speed Range 80,000rpm
Max. Power 1.5㎾
Static Axial Load Min 20kgf
Static Radial Load Min 15kgf
Static Runout 0.5㎛
◈ Use : 12" Wafer Dicing Machines ◈